- Manufacturer：
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- CUI Devices (2)
- Malico (1)
- Attachment Method：
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- Material：
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- Material Finish：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUSION, 19 X 31.5 |
979
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, 19 X 31.5 |
1,542
In-stock
|
View details Get Quote | ||
|
|
Malico | AL HEAT SINK 19X19X10MM |
224
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT SINK 19X19MM |
122
In-stock
|
View details Get Quote |
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