- Manufacturer：
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- CUI Devices (2)
- Sarnikon (3)
- Attachment Method：
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- Diameter：
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- Material：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUSION, 19 X 31.5 |
979
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, 19 X 31.5 |
1,542
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 25MM X 150MM |
10
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 25MM X 50MM |
10
In-stock
|
View details Get Quote | ||
|
|
Sarnikon | EXTRUDED HEATSINK 25MM X 50MM |
6,982
In-stock
|
View details Get Quote |
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