- Manufacturer：
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- CUI Devices (2)
- Attachment Method：
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- Material：
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- Material Finish：
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- Power Dissipation @ Temperature Rise：
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
61
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, 17 X 31.9 |
2,841
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
24
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, 17 X 31.9 |
9,173
In-stock
|
View details Get Quote |
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