- Manufacturer:
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- Cooling Source (1)
- CUI Devices (2)
- Attachment Method:
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- Material:
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- Material Finish:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
2,224
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, 17 X 31.9 |
2,841
In-stock
|
View details Get Quote | ||
|
T-Global Technology | ALUMINIUM HEAT SINK 17X17MM |
66
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, 17 X 31.9 |
9,173
In-stock
|
View details Get Quote | ||
|
Cooling Source | 17X17 95MM WITH INTERFACE MATERI |
7,431
In-stock
|
View details Get Quote |









