- Manufacturer:
-
- BOYD (3)
- Comair Rotron (2)
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Product Status:
-
- Thermal Resistance @ Natural:
-
5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEAT SINK |
6,051
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK EXTRUDED 25X41.6X38.1MM |
7,890
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK EXTRUDED 25X41.6X38.1MM |
7,603
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
6,333
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
7,732
In-stock
|
View details Get Quote |









