- Manufacturer:
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- BOYD (4)
- CTS Corporation (1)
- Attachment Method:
-
- Diameter:
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- Fin Height:
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- Length:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Product Status:
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- Thermal Resistance @ Forced Air Flow:
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- Type:
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
3,135
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
2,387
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK BGA 23X23X10MM W/ADH |
2,559
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
33
In-stock
|
View details Get Quote | ||
|
NTE Electronics, Inc. | HEAT SINK-TO-5 TRANS 3.0W |
12
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
9,358
In-stock
|
View details Get Quote | ||
|
CTS Corporation | HEATSINK CAP .500"H BLACK O-3 |
5,395
In-stock
|
View details Get Quote | ||
|
BOYD | BOARD LEVEL HEAT SINK |
9,666
In-stock
|
View details Get Quote |









