- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 17 X 17 X 6 MM |
2,904
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
2,224
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 17X17X6MM |
5,576
In-stock
|
View details Get Quote |









