- Manufacturer：
-
- BOYD (1)
- Attachment Method：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEATSINK .375"TO-220 |
6,461
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3 76.2X19.1X0.21MM |
5,142
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3N NANO 76.2X19.1X0.07MM |
6,472
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | PH3N NANO 76.2X19.1X0.062MM |
5,454
In-stock
|
View details Get Quote |
Copyright © GUANGHONGFA (HK)TECHNOLOGY CO., LIMITED All Rights Reserved. 
