- Manufacturer：
-
- CUI Devices (5)
- Attachment Method：
-
- Length：
-
- Material：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
12 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 35MM X 12.5MM |
176
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 35MM X 35MM X 12.5MM |
120
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 35X35X12.5MM |
438
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
1,558
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 50 |
1,505
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | ALUM HEAT SINK MAXIFLOW |
1,741
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 35X35X12.5MM |
91
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK 35X35X12.5MM |
92
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 63 |
5,072
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 35MMX35MMX12.5MM W/O TI |
9
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 27 |
9,372
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 25 |
9,137
In-stock
|
View details Get Quote |
Copyright © GUANGHONGFA (HK)TECHNOLOGY CO., LIMITED All Rights Reserved. 
