- Manufacturer：
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- CUI Devices (2)
- Seeed (1)
- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,563
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,907
In-stock
|
View details Get Quote | ||
|
|
Seeed | ALUMINUM HEATSINK WITH FAN FOR J |
248
In-stock
|
View details Get Quote |
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