- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,563
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
2,907
In-stock
|
View details Get Quote |
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