- Manufacturer：
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- CUI Devices (5)
- Length：
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- Material：
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- Material Finish：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 14 X 14 X 6 MM |
3,238
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 X 17 X 6 MM |
2,904
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 X 23 X 6 MM |
1,236
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 X 21 X 6 MM |
1,761
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 X 27 X 6 MM |
1,455
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X15X6MM |
100
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X15X6MM |
5
In-stock
|
View details Get Quote |
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