- Manufacturer:
-
- CUI Devices (2)
- Attachment Method:
-
- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUSION, 19 X 31.5 |
979
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19MM X 7.5MM |
358
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 19X19X7.5MM |
474
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, 19 X 31.5 |
1,542
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19MM X 7.5MM |
492
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSINK 19X19X7.5MM |
330
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X7.5MM W/OUT TIM |
8,422
In-stock
|
View details Get Quote |









