- Manufacturer：
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- CUI Devices (4)
- Ohmite (1)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Type：
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 25 |
16,706
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 20 X 20 X 9 MM |
1,068
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
1,943
In-stock
|
View details Get Quote | ||
|
|
Ohmite | BGA HEATSINK W/TAPE |
282
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 25 |
6,329
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 25 |
7,011
In-stock
|
View details Get Quote |
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