- Manufacturer:
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- CUI Devices (1)
- Attachment Method:
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- Material:
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- Package Cooled:
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- Thermal Resistance @ Natural:
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- Type:
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8 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19MM X 9.5MM |
1,609
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19MM X 9.5MM |
199
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19MM X 9.5MM |
803
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19MM X 9.5MM |
114
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | MAXIFLOW 18.25X18.25X9.5MM T766 |
99
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X9.5MM W/OUT TIM |
6
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
6,507
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X9.5MM W/OUT TIM |
5,559
In-stock
|
View details Get Quote |









