- Manufacturer:
-
- BOYD (1)
- Comair Rotron (1)
- Attachment Method:
-
- Material:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Product Status:
-
- Thermal Resistance @ Forced Air Flow:
-
2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | 65715 EXTRUSION 0.39X1"X4' |
124
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK STAMP 26.2X12.7X9.9MM |
9,660
In-stock
|
View details Get Quote |









