- Manufacturer:
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- CUI Devices (5)
- Length:
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- Material:
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- Material Finish:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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10 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X45X10MM |
177
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 254X100X10MM |
147
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 23 X 23 X 10 MM |
5,076
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 40 X 40 X 10 MM |
1,010
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA,25 X 25 X 10 MM |
617
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 18 X 18 X 10 MM |
302
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X45X10MM |
14
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X100X10MM |
4
In-stock
|
View details Get Quote | ||
|
TE Connectivity AMP Connectors | HEAT SINK SFP DWDM 10.0MM TALL |
6,437
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 60 X 60 X 10 MM |
6,899
In-stock
|
View details Get Quote |









