- Manufacturer:
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- BOYD (2)
- Cooling Source (2)
- Attachment Method:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Type:
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK BGA W/ADHESIVE TAPE |
567
In-stock
|
View details Get Quote | ||
|
BOYD | BGA HEAT SINK |
3,616
In-stock
|
View details Get Quote | ||
|
Cooling Source | 27X27X10MM, T411 |
713
In-stock
|
View details Get Quote | ||
|
Cooling Source | 27X27X10MM, T412 |
713
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
7,661
In-stock
|
View details Get Quote |









