Material:
Material Finish:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSS-B20-NP-15 CUI Devices
HEATSINK TO-220 4.1W ALUMINUM
RFQ
312
In-stock
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NTE411 NTE Electronics, Inc.
HEAT SINK STUD-MOUNT TO5
RFQ
992
In-stock
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