- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 45 X 45 X 15 MM |
119
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 21 X 21 X 15 MM |
36
In-stock
|
View details Get Quote |









