- Manufacturer：
-
- Comair Rotron (3)
- CUI Devices (2)
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220/TO- |
534
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK EXTRUDED 16X16.5X38.1MM |
6,621
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK EXTRUDED 16X16.5X50.8MM |
9,846
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK EXTRUDED 16X16.5X25.4MM |
8,684
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220/TO- |
5,632
In-stock
|
View details Get Quote |
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