- Manufacturer：
-
- Comair Rotron (1)
- CUI Devices (4)
- Ohmite (1)
- Attachment Method：
-
- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK TO-218,TO-220,TO-247 |
11,690
In-stock
|
View details Get Quote | ||
|
Comair Rotron | HEATSINK EXTRUDED 25X41.6X38.1MM |
7,603
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 38 |
9,790
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 38 |
6,736
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 38 |
6,142
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218, 38 |
7,799
In-stock
|
View details Get Quote |
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