Manufacturer:
Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
VXA-55-101E Ohmite
EXTRUDED HEATSINK ANODIZED 55MM
RFQ
90
In-stock
View details Get Quote
HSS-B20-053H-01 CUI Devices
HEATSINK TO-220 4.8W ALUMINUM
RFQ
2,958
In-stock
View details Get Quote
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