Attachment Method:
Material Finish:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
ATS-EXL116-300-R0 Advanced Thermal Solutions, Inc.
EXTRUSION 300X51.6X42.5MM
RFQ
37
In-stock
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ATS-EXL116-1220-R0 Advanced Thermal Solutions, Inc.
PCIE EXTRUSION PROFILE, AL6063
RFQ
9
In-stock
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HSS-B20-0508H-01 CUI Devices
HEATSINK TO-220 7.4W ALUMINUM
RFQ
6,772
In-stock
View details Get Quote
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