- Manufacturer:
-
- CUI Devices (1)
- Material:
-
- Material Finish:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
9 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 248X101X14MM |
292
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
75
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
68
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 30.7 X 30.7 X 14 |
409
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
5
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
3
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220X101X14MM |
2
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
5,006
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION PROFILE, AL6063 |
8,636
In-stock
|
View details Get Quote |









