Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
V2017B ASSMANN WSW Components
HEATSINK ANOD ALUM CPU
RFQ
2,804
In-stock
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HSB02-101007 CUI Devices
HEAT SINK, BGA, 10 X 10 X 7 MM
RFQ
1,700
In-stock
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