- Manufacturer:
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- CUI Devices (2)
- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK 10X10X19MM |
66
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 3.6W ALUMINUM |
5,922
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEATSINK TO-220 3.6W ALUMINUM |
7,765
In-stock
|
View details Get Quote |









