Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSB03-141406 CUI Devices
HEAT SINK, BGA, 14 X 14 X 6 MM
RFQ
3,238
In-stock
View details Get Quote
V2286B ASSMANN WSW Components
CPU HEATSINK, CROSS CUT, AL6063,
RFQ
2,965
In-stock
View details Get Quote
V2020B ASSMANN WSW Components
HEATSINK CPU XCUT
RFQ
451
In-stock
View details Get Quote
1 / 1 Page, 3 Records
0.668065s