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Fin Height：
Power Dissipation @ Temperature Rise：
Thermal Resistance @ Forced Air Flow：
Thermal Resistance @ Natural：
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2 Records
Image Part Manufacturer Description Stock Action
HSB05-171711
HSB05-171711
 CUI Devices
HEAT SINK, BGA, 17 X 17 X 11.5 M
RFQ
3,576
In-stock
 View details Get Quote
HSB04-171706
HSB04-171706
 CUI Devices
HEAT SINK, BGA, 17 X 17 X 6 MM
RFQ
2,904
In-stock
 View details Get Quote
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UNIT 1405B 14/F, THE BELGIAN BANK BUILDING, NOS.721-725 NATHAN ROAD, MONGKOK, KOWLOON.HK
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