Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
V2022B ASSMANN WSW Components
HEATSINK CPU XCUT
RFQ
5,825
In-stock
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HSB08-212106 CUI Devices
HEAT SINK, BGA, 21 X 21 X 6 MM
RFQ
1,761
In-stock
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