Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSB08-212106 CUI Devices
HEAT SINK, BGA, 21 X 21 X 6 MM
RFQ
1,761
In-stock
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HSB09-212115 CUI Devices
HEAT SINK, BGA, 21 X 21 X 15 MM
RFQ
36
In-stock
View details Get Quote
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