Image Part Manufacturer Description Stock Action
HSB24-252510 CUI Devices
HEAT SINK, BGA,25 X 25 X 10 MM
RFQ
617
In-stock
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HSB11-252518 CUI Devices
HEAT SINK, BGA, 25 X 25 X 18 MM
RFQ
6,358
In-stock
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625-45ABT3 Wakefield Thermal
HEATSINK CPU 25MM SQ W/DBL TAPE
RFQ
7,833
In-stock
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