- Manufacturer:
-
- CUI Devices (3)
- Malico (5)
- Ohmite (1)
- Attachment Method:
-
- Fin Height:
-
- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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13 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU XCUT |
1,640
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 27 X 27 X 6 MM |
1,455
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
1,417
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
1,311
In-stock
|
View details Get Quote | ||
|
Malico | AL HEAT SINK 27X27X21MM WITH PIN |
180
In-stock
|
View details Get Quote | ||
|
Malico | AL HEAT SINK 27X27X12MM WITH PIN |
170
In-stock
|
View details Get Quote | ||
|
Malico | AL HEAT SINK 27X27X25MM WITH ELL |
180
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 27 X 27 X 18 MM |
631
In-stock
|
View details Get Quote | ||
|
Ohmite | BGA HEATSINK W/TAPE |
36
In-stock
|
View details Get Quote | ||
|
Malico | AL HEAT SINK 27X27X12MM WITH PIN |
100
In-stock
|
View details Get Quote | ||
|
Malico | AL HEAT SINK 27X27X15MM WITH ELL |
40
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 27 |
9,372
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
7,661
In-stock
|
View details Get Quote |









