- Manufacturer:
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- BOYD (3)
- CUI Devices (1)
- Attachment Method:
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- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK BGA W/ADHESIVE TAPE |
547
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK BGA 35X35X18MM W/ADH |
329
In-stock
|
View details Get Quote | ||
|
BOYD | HEATSINK BGA W/O SOLDER ANCHORS |
870
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
1,494
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 35 X 35 X 18 MM |
956
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 35X35X18MM |
50
In-stock
|
View details Get Quote |









