- Manufacturer:
-
- CUI Devices (3)
- Malico (4)
- Attachment Method:
-
- Fin Height:
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- Material Finish:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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16 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 35 X 35 X 25 MM |
446
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
1,252
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
1,427
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | ANCHOR HEATSINK 35X35X21MM |
160
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
1,494
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | ANCHOR HEATSINK 35X35X15MM |
1,005
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | ANCHOR HEATSINK 35X35X12MM |
938
In-stock
|
View details Get Quote | ||
|
Malico | AL HEAT SINK 35X35X23MM WITH PIN |
174
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 35 |
866
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 35 X 35 X 18 MM |
956
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK CPU STAMPED |
217
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | ANCHOR HEATSINK 35X35X12.5MM |
92
In-stock
|
View details Get Quote | ||
|
Malico | AL HEAT SINK 35X35X10MM |
100
In-stock
|
View details Get Quote | ||
|
Malico | AL HEAT SINK 35X35X20MM |
100
In-stock
|
View details Get Quote | ||
|
Malico | AL HEAT SINK 25X25X5MM WITH LINE |
96
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK CPU W/ADHESIVE STAMPED |
7,489
In-stock
|
View details Get Quote |









