- Manufacturer:
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- CUI Devices (2)
- Attachment Method:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK TO-220/TOP-3/SOT-32 |
4,243
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
1,558
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
942
In-stock
|
View details Get Quote |









