- Manufacturer：
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- BOYD (1)
- CUI Devices (2)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK TO-220/TOP-3/SOT-32 |
4,243
In-stock
|
View details Get Quote | ||
|
|
BOYD | THM,ZA1831 ISS 3 TV-40G |
305
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
1,558
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT SINK 38X38MM |
33
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 38 |
942
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 DUAL BLACK |
8,028
In-stock
|
View details Get Quote |
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