Manufacturer:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
OMNI-UNI-27-50 Wakefield Thermal
HEATSINK TO-247 TO-264 TO-220
RFQ
1,872
In-stock
View details Get Quote
HSE08-505028 CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
RFQ
1,101
In-stock
View details Get Quote
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