- Manufacturer：
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- CUI Devices (5)
- Malico (2)
- Attachment Method：
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- Length：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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12 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU XCUT |
5,825
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCUT |
1,640
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 X 14 X 6 MM |
3,238
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 X 17 X 6 MM |
2,904
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 X 23 X 6 MM |
1,236
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
2,965
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 X 21 X 6 MM |
1,761
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 X 27 X 6 MM |
1,455
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
2,224
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCUT |
948
In-stock
|
View details Get Quote | ||
|
|
Malico | AL HEAT SINK 30X30X6MM |
100
In-stock
|
View details Get Quote | ||
|
|
Malico | AL HEAT SINK 45X45X6MM |
64
In-stock
|
View details Get Quote |
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