- Manufacturer：
-
- CUI Devices (2)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU XCUT |
40,537
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 8.5 X 8.5 X 8 MM |
788
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.5 X 33.5 X 8 |
937
In-stock
|
View details Get Quote |
Copyright © GUANGHONGFA (HK)TECHNOLOGY CO., LIMITED All Rights Reserved. 
