- Manufacturer:
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- CUI Devices (1)
- Malico (1)
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Type:
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2 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Malico | AL HEAT SINK 15X15X10MM |
220
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
6,507
In-stock
|
View details Get Quote |









