- Manufacturer：
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- CUI Devices (2)
- Malico (1)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 |
1,930
In-stock
|
View details Get Quote | ||
|
|
Malico | AL HEAT SINK 17X17X11MM |
218
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 19 |
8,780
In-stock
|
View details Get Quote |
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