- Manufacturer:
-
- CUI Devices (3)
- Attachment Method:
-
- Material Finish:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
9 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 30.7 X 30.7 X 14 |
409
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK ALUM ANOD |
190
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION, TO-220, 25 |
313
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK CPU W/ADHESIVE STAMPED |
7,403
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK CPU STAMPED |
7,695
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, EXTRUSION,TO-220, 38. |
7,514
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK CPU W/ADHESIVE STAMPED |
7,888
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | HEATSINK CPU STAMPED |
5,735
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | FINGER-SHAPED-HEATSINK 8K/W |
7,914
In-stock
|
View details Get Quote |









