- Manufacturer：
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- CUI Devices (2)
- Malico (3)
- Attachment Method：
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- Length：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 45 X 45 X 15 MM |
119
In-stock
|
View details Get Quote | ||
|
Malico | AL HEAT SINK 23X23X15MM WITH PIN |
158
In-stock
|
View details Get Quote | ||
|
|
Malico | AL HEAT SINK 29X29X15MM WITH ELL |
176
In-stock
|
View details Get Quote | ||
|
|
Malico | AL HEAT SINK 27X27X15MM WITH ELL |
40
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 X 21 X 15 MM |
36
In-stock
|
View details Get Quote |
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