Manufacturer:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSB27-434316 CUI Devices
HEAT SINK, BGA, 43.1 X 43.1 X 16
RFQ
994
In-stock
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WAVE-23-165 Wakefield Thermal
ANCHOR HEATSINK 23X23X16.5MM
RFQ
464
In-stock
View details Get Quote
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