- Manufacturer：
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- BOYD (1)
- CUI Devices (2)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Width：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
1,101
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
983
In-stock
|
View details Get Quote | ||
|
BOYD | 78015 4.6 |
7,036
In-stock
|
View details Get Quote |
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