- Manufacturer：
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- BOYD (1)
- CUI Devices (25)
- Fin Height：
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- Length：
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- Material Finish：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Width：
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26 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 17 X 17 X 11.5 M |
3,576
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 10 X 10 X 7 MM |
1,700
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 14 X 14 X 6 MM |
3,238
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 17 X 17 X 6 MM |
2,904
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 23 X 23 X 6 MM |
1,236
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 20 X 20 X 9 MM |
1,068
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 21 X 21 X 6 MM |
1,761
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 27 X 27 X 6 MM |
1,455
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 12 X 12 X 18 MM |
2,082
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 23 X 23 X 10 MM |
5,076
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 40 X 40 X 10 MM |
1,010
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 35 X 35 X 25 MM |
446
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 40 X 40 X 25 MM |
735
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 43.1 X 43.1 X 16 |
994
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 45 X 45 X 15 MM |
119
In-stock
|
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|
|
BOYD | 61085 EXTRUSION 1.312X5.375"X4' |
19
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA,25 X 25 X 10 MM |
617
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 18 X 18 X 10 MM |
302
In-stock
|
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|
|
CUI Devices | HEAT SINK, BGA, 33.5 X 33.5 X 8 |
937
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.7 X 30.7 X 14 |
409
In-stock
|
View details Get Quote |
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