- Manufacturer：
-
- CUI Devices (2)
- Attachment Method：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
1,101
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- |
971
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 HIGH RISE |
7,747
In-stock
|
View details Get Quote |
Copyright © GUANGHONGFA (HK)TECHNOLOGY CO., LIMITED All Rights Reserved. 
