- Manufacturer:
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- CUI Devices (4)
- Fin Height:
-
- Length:
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- Material:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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7 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 COPPER |
13,858
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 COPPER |
117,406
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, STAMPING, TO-220, 12. |
1,781
In-stock
|
View details Get Quote | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-PAK COPPER |
307
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK TO-263 COPPER |
120
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK TO-263 COPPER |
5,825
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK TO-252 COPPER |
7,803
In-stock
|
View details Get Quote |









