- Manufacturer:
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- BOYD (1)
- CUI Devices (1)
- Attachment Method:
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- Material:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
BOYD | HEATSINK BGA W/ADHESIVE TAPE |
2,572
In-stock
|
View details Get Quote | ||
|
ASSMANN WSW Components | CPU HEATSINK, CROSS CUT, AL6063, |
1,311
In-stock
|
View details Get Quote | ||
|
CUI Devices | HEAT SINK, BGA, 27 X 27 X 18 MM |
631
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 27X18MM FRONT PUSH PIN |
74
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 27X18MM SIDE PUSH PIN |
42
In-stock
|
View details Get Quote | ||
|
Wakefield Thermal | HEATSINK 27X18MM DIA PUSH PIN |
9,721
In-stock
|
View details Get Quote |









